Bluetooth^® LE Wireless Microcontroller

• 64 MHz STAR-MC1 processor (compatible with Arm^®Cortex^®-M33)

• On-chip memories

  • SRAM

    • GR5111DEBC: 112 KB

    • GR5112DGBC: 160 KB

  • Internal Flash

    • GR5111DEBC: 512 KB

    • GR5112DGBC: 1 MB

• Bluetooth LE Stack

  • Encrypted Advertising Data (EAD)

  • Up to 16 simultaneous connections

• High-performance radio

  • TX power: up to +4 dBm

  • RX sensitivity: –97 dBm @ Bluetooth LE 1 Mbps

• Security

  • Complete secure computing engine

    • AES 128-bit/192-bit/256-bit symmetric encryption (ECB, CBC)

    • Hash-based Message Authentication Code (HMAC-SHA256)

    • Public-key cryptography (PKC)

    • True random number generator (TRNG)

    • Hardware CRC32 with DMA input support

  • Comprehensive security operation mechanism

    • Secure boot

    • Secure debug

    • Secure key storage

• MCU peripherals

  • Digital peripherals

    • 1 x 6-channel DMA with M2M, M2P, and P2M transmission modes

  • Analog peripherals

    • 1x ADC with 10-bit ENOB (max. 1000 ksps), supporting up to eightI/O channels and two internal signal channels

    • Integrated programmable gain amplifier (PGA) that offers selectable gains of x2, x4, and x8, achieving an equivalent INL of 0.25 LSB (10-bit) @ x8 gain

    • 1 x low-power comparator supporting wake-up from sleep mode

    • Built-in die temperature sensor and voltage sensor

  • Communication peripherals

    • 1 x SPI master interface, up to 32 MHz

    • 2 x I2C interfaces for peripheral communication, up to 1 Mbps

    • 2 x UART interfaces up to 4 Mbps, supporting flow control (UART1 only), IrDA, and 1-wire protocol

  • I/O peripherals

    • 11 x I/Os

  • Timers

    • 2 x general-purpose, 32-bit timers

    • 1 x dual timer composed of two programmable 32-bit or 16-bit down counters

    • 1 x sleep timer for waking the device up from sleep mode

    • 2 x AON watchdog timers with configurable clock source, supporting independent running

    • 1 x real-time counter (RTC)

    • 2 x PWM modules (PWM0: 2-channel, PWM1: 3-channel) with edge-aligned mode and center-aligned mode

  • Debug

    • SWD interface

  • Clocks

    • 24 MHz crystal oscillator (doubled internally to 48 MHz)

    • 32.768 kHz crystal oscillator

    • Built-in 32 kHz low-frequency RC oscillator

    • Built-in 64 MHz high-frequency RC oscillator

    • Built-in 256 kHz low-frequency RC oscillator

• Power management

  • On-chip DC-DC converter and LDO regulators

  • Supply voltage: 2.0 V-3.3 V, single power supply with buck mode

Analog Front-end (AFE)

• 3 x DACs, up to 12-bit resolution, with a bias voltage range of –700 mV to 700 mV

• 2 x 24-bit ADCs with 17.4-bit ENOB

• Current detection range: 0.1 nA to 2 μA, with referred-to-input noise of 2 pA @ 3.2 MΩ

Low Power Consumption

• Bluetooth LE MCU power consumption

  • 30 μA/MHz running CoreMark^® @ 3.3 V VSYSH input, 64 MHz clock

  • Sleep mode: 2.72 μA @ 3.3 V VSYSH input, with 32 KB data retained, wake-up source from AON timer, GPIO, and Bluetooth LE events

  • Ship mode: 20 nA with VSYSH on, can be woken up by a dedicated pin, saving system power during storage and shipping

• Radio consumption

  • TX current: 4.0 mA @ 0 dBm, 3.3 V VSYSH input

  • RX current: 3.5 mA @ 3.3 V VSYSH input

• AFE power consumption

  • Bias mode: 6.4 μA (3.0 V, one 3-terminal sensor)

  • Working electrode (WE) current sampling mode: 6.6 μA (3.0 V, single sensor @1 Hz sampling rate)

ESD

• HBM: 2 kV

• CDM: 500 V

Operating Temperature

• Temperature range: 0°C to 70°C

Package

• BGA45: 3.0 mm x 3.0 mm x 0.77 mm, 0.4/0.5 mm pitch

• RoHS compliant